NXP Semiconductors N.V. (NASDAQ: NXPI) creates, produces and provides Secure Connections for a Smarter World. This involves the collaborative efforts of 45,000 people in 36 countries across the globe. Since the merger of Freescale and NXP on December 7th, 2015, NXP has become the world’s 4th largest non-memory chip manufacturer. With over 10 B$ revenue and annual investments in R&D of 1.5 B$ NXP is an innovation powerhouse. NXP demonstrates thought leadership in Smart Connected Solutions for consumer and industrial applications, in Secure Connected Vehicle and in End-to-End Security & Privacy, playing a leading role in the Internet of Things area, where connectivity and security are key drivers.
Within the NexGen project, the aim of NXP’s contribution is to bring in a single chip solution for impedimetric/capacitive skin measurements. NXP will be involved in the definition of requirements and specifications of the miniaturised smart demonstrators, with focus on sensor readout, power and communication requirements. Furthermore, NXP will perform simulations to evaluate the sensor principles (mainly dehydration sensing) and modeling to evaluate optimal antenna design for wireless communication (BLE versus MI versus NFC). Additionally, NXP will contribute to the electrical and reliability testing at chip- and board-level as well as to the functional demonstrator evaluation.